传真：010-62362261
电话：010-82995685台积公司 TSMC
台积电简介
台积公司成立于1987年，在半导体产业中首创专业集成电路制造服务模式。2010年中，台积公司为全球四百多个客户提供服务，生产超过七千多种的芯片，被广泛地运用在计算机产品、通讯产品与消费类电子产品等多样应用领域；2011年，台积公司所拥有及管理的产能预计将达到1,360万片八吋约当晶圆。台积公司在台湾设有二座先进的十二吋超大型晶圆厂 (fab 12 & 14)、四座八吋晶圆厂 (fab 3, 5, 6 & 8) 和一座六吋晶圆厂 (fab 2)，并拥有二家海外子公司 WaferTech 美国子公司、TSMC (中国) 有限公司及其它转投资公司之八吋晶圆厂产能支持。此外，台积公司预计将于2011年完成另一座十二吋超大型晶圆厂 (fab 15) 的兴建。
台积公司的全球总部位于台湾新竹科学园区，在北美、欧洲、日本、中国大陆、南韩、印度等地均设有子公司或办事处，提供全球客户实时的业务和技术服务。
TSMC introduction
TSMC created the semiconductor Dedicated IC Foundry business model when it was founded in 1987. TSMC served more than 400 customers in 2010, manufacturing more than 7,000 products for various applications covering a variety of computer, communications and consumer electronics market segments. Total capacity of the manufacturing facilities managed by TSMC, including subsidiaries and joint ventures, is expected to to reach 13.6 million eight-inch equivalent wafers in 2011. TSMC operates two advanced 12-inch wafer GIGAFAB™ facilities (fab 12 and 14), four eight-inch wafer fabs (fab 3, 5, 6, and 8), and one six-inch wafer fab (fab 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited, and its joint venture fab, SSMC in Singapore. One additional 12-inch Fab (fab 15) is under construction and is expected to go on line in 2011.
TSMC is headquartered in the Hsinchu Science Park, Taiwan, and has account management and engineering service offices in China, Europe, India, Japan, North America, and, South Korea.